HyperX Black 8GB 1866Mhz DDR3L Non-ECC 204-Pin CL11 SODIMM Laptop Memory Module
HyperX HX318LS11IB/8 is a 1G x 64-bit (8GB) DDR3L-1866 CL11 SDRAM (Synchronous DRAM) 2Rx8, low voltage, memory modules, based on sixteen 512M x 8-bit DDR3 FBGA components. This module has been tested to run at DDR3L-1866 at a low latency timing of 11-11-11 at 1.35V or 1.5V. HyperX Impact memory boasts the world’s fastest SO-DIMM frequency – 2666MHz – to keep you ahead of the curve and level up your game. It automatically recognises the platform it’s plugged into and auto overclocks to the highest frequency published (up to 2400MHz) with no need to adjust system BIOS settings. So you get extreme performance that supports notebooks and other small form factor systems using either AMD or the latest Intel CPU technologies with no hassle at all – even if you’re a newbie. PnP JEDEC TIMING PARAMETERS: – DDR3-1866 CL11-11-11 @1.35V or 1.5V – DDR3-1600 CL10-10-10 @1.35V or 1.5V – DDR3-1333 CL8-8-8 @1.35V or 1.5V Key Features – JEDEC standard 1.35V (1.28V ~ 1.45V) and 1.5V (1.425V ~ 1.575V) Power Supply – VDDQ = 1.35V (1.28V ~ 1.45V) and 1.5V (1.425V ~ 1.575V) – 933MHz fCK for 1866Mb/sec/pin – 8 independent internal bank – Programmable CAS Latency: 13, 11, 10, 9, 8, 7, 6, 5 – Programmable Additive Latency: 0, CL – 2, or CL – 1 clock – 8-bit pre-fetch – Burst Length: 8 (Interleave without any limit, sequential with starting address â000â only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS] – Bi-directional Differential Data Strobe – Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%) – On Die Termination using ODT pin – Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95°C – Asynchronous Reset – PCB : Height 1.180â (30.00mm), double sided component Specifications Brand: Kingston Application: Laptop Capacity: 8GB Memory Frequency: 1866MHz Memory Transmission Type: DDR3L CAS Latency: CL11 Number of Pins: 204-pin Error Checking: Non-ECC Form Factor: SoDIMM Product weight: 0.0100 kg Package weight: 0.0490 kg Product Size(L x W x H): 6.70 x 3.00 x 0.20 cm / 2.64 x 1.18 x 0.08 inches Package Size(L x W x H): 17.00 x 5.60 x 1.50 cm / 6.69 x 2.2 x 0.59 inches Box Contents 1 x HyperX 8GB 1G x 64-Bit DDR3L-1866 CL11 204-Pin SODIMM
HyperX HX318LS11IB/8 is a 1G x 64-bit (8GB) DDR3L-1866 CL11 SDRAM (Synchronous DRAM) 2Rx8, low voltage, memory modules, based on sixteen 512M x 8-bit DDR3 FBGA components. This module has been tested to run at DDR3L-1866 at a low latency timing of 11-11-11 at 1.35V or 1.5V. HyperX Impact memory boasts the world’s fastest SO-DIMM frequency – 2666MHz – to keep you ahead of the curve and level up your game. It automatically recognises the platform it’s plugged into and auto overclocks to the highest frequency published (up to 2400MHz) with no need to adjust system BIOS settings. So you get extreme performance that supports notebooks and other small form factor systems using either AMD or the latest Intel CPU technologies with no hassle at all – even if you’re a newbie. PnP JEDEC TIMING PARAMETERS: – DDR3-1866 CL11-11-11 @1.35V or 1.5V – DDR3-1600 CL10-10-10 @1.35V or 1.5V – DDR3-1333 CL8-8-8 @1.35V or 1.5V Key Features – JEDEC standard 1.35V (1.28V ~ 1.45V) and 1.5V (1.425V ~ 1.575V) Power Supply – VDDQ = 1.35V (1.28V ~ 1.45V) and 1.5V (1.425V ~ 1.575V) – 933MHz fCK for 1866Mb/sec/pin – 8 independent internal bank – Programmable CAS Latency: 13, 11, 10, 9, 8, 7, 6, 5 – Programmable Additive Latency: 0, CL – 2, or CL – 1 clock – 8-bit pre-fetch – Burst Length: 8 (Interleave without any limit, sequential with starting address â000â only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS] – Bi-directional Differential Data Strobe – Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%) – On Die Termination using ODT pin – Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95°C – Asynchronous Reset – PCB : Height 1.180â (30.00mm), double sided component Specifications Brand: Kingston Application: Laptop Capacity: 8GB Memory Frequency: 1866MHz Memory Transmission Type: DDR3L CAS Latency: CL11 Number of Pins: 204-pin Error Checking: Non-ECC Form Factor: SoDIMM Product weight: 0.0100 kg Package weight: 0.0490 kg Product Size(L x W x H): 6.70 x 3.00 x 0.20 cm / 2.64 x 1.18 x 0.08 inches Package Size(L x W x H): 17.00 x 5.60 x 1.50 cm / 6.69 x 2.2 x 0.59 inches Box Contents 1 x HyperX 8GB 1G x 64-Bit DDR3L-1866 CL11 204-Pin SODIMM
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