HyperX Savage 32GB (4x8GB) Memory Kit 1866MHz DDR3 Non-ECC CL9 240-pin DIMM 1.5V XMP
… FBGA components per module. Each module kit supports Intel XMP (Extreme Memory Profiles). Total kit capacity is 32GB. Each module has been tested to run at DDR3-1866 at a low latency timing of 9-10-11 at 1.5V. The SPDs are programmed to JEDEC standard latency DDR3-1600 timing of 11-11-11 at 1.5V. Each 240-pin DIMM uses gold contact fingers.FeaturesJEDEC standard 1.5V (1.425V ~ 1.575V) Power SupplyVDDQ = 1.5V (1.425V ~ 1.575V)800MHz fCK for 1600Mb/sec/pin8 independent internal banksProgrammable CAS Latency: 11, 10, 9, 8, 7, 6Programmable Additive Latency: 0, CL – 2, or CL – 1 clock8-bit pre-fetchBurst Length: 8 (Interleave without any limit, sequential with starting address ‘000’ only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS]Bi-directional Differential Data StrobeInternal (self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%)On Die Termination using ODT pinAverage Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95°CAsynchronous ResetPCB: Height 1.18 inch (30mm), double sided componentExtra InfoMemory Size: 32768MBModule Size: 8192MBMemory Type: DDR3Memory Package: DIMMPin Configuration: 240 pinsMain Colour: Red
… FBGA components per module. Each module kit supports Intel XMP (Extreme Memory Profiles). Total kit capacity is 32GB. Each module has been tested to run at DDR3-1866 at a low latency timing of 9-10-11 at 1.5V. The SPDs are programmed to JEDEC standard latency DDR3-1600 timing of 11-11-11 at 1.5V. Each 240-pin DIMM uses gold contact fingers.FeaturesJEDEC standard 1.5V (1.425V ~ 1.575V) Power SupplyVDDQ = 1.5V (1.425V ~ 1.575V)800MHz fCK for 1600Mb/sec/pin8 independent internal banksProgrammable CAS Latency: 11, 10, 9, 8, 7, 6Programmable Additive Latency: 0, CL – 2, or CL – 1 clock8-bit pre-fetchBurst Length: 8 (Interleave without any limit, sequential with starting address ‘000’ only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS]Bi-directional Differential Data StrobeInternal (self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%)On Die Termination using ODT pinAverage Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95°CAsynchronous ResetPCB: Height 1.18 inch (30mm), double sided componentExtra InfoMemory Size: 32768MBModule Size: 8192MBMemory Type: DDR3Memory Package: DIMMPin Configuration: 240 pinsMain Colour: Red
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